Senior/Staff Process Engineer (Flip Chip)
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About this role
Core Responsibilities - Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow. - DOE to characterize process window and margin. Optimize process integration with upstream processes (e.g…
Excerpt only. The full posting is on the employer’s careers site.
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