Senior/Staff Process Engineer (Wafer Dicing & Back-grind)

Lumilens · Singapore

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About this role

Core Responsibilities - Responsible for silicon photonic wafer backside grinding/thinning process, laser stealth dicing process and die sorting development for silicon photonic chips, with OSAT or internal line. - Optimize wafer thinning thickness, grinding speed, cutting path and laser cutting parameters to avoid chip crack, edge chipping and optical structure damage of silicon photonic wafers…

Excerpt only. The full posting is on the employer’s careers site.

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