System & Advanced Packaging Design Lead
EmployerPhizenix
LocationSanta Clara, CA (Hybrid)
Pay$180,000 – $200,000 per year
Posted2026-10-12
Confirmed open2026-10-29
Apply on the employer’s site Open in Atlas
About this role
Role Overview We are seeking an Advanced 2.5D/3D/Chiplet packaging Lead, who will be directing Signal Integrity for Package, PCB and System design for Copper Interconnects beyond 200G, Work on enabling advanced packaging for Driver, TIA & Optics for AI Scale up engine including SI/ PI, Reliability, Thermals and HVM; Also drive Micro-LED packaging and Heterogeneous package development. Good…
Excerpt only. The full posting is on the employer’s careers site.
More jobs at Phizenix
- Enterprise Account ExecutivePhizenix · Remote
- Business Development RepresentativePhizenix · Remote
- Staff Platform EngineerPhizenix · Remote
- Principal Platform EngineerPhizenix · Remote
- Confluence Solution Architect (French-speaking)Phizenix · Remote