Group Leader – Wire Bond & Mold

3D Glass Solutions, Inc · Bhubaneswar, Odisha

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About this role

Job/Position Summary The Group Leader – Wire Bond & Mold is responsible for leading development, optimization, qualification, and manufacturing support activities for plasma treatment, wire bonding, compression and transfer molding, post-mold cure, deflash, and laser marking processes used in advanced semiconductor assembly. The role focuses on achieving robust interconnect and encapsulation…

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